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R&D Packaging Design Engineer

Department: OMD R&D
Job Code: OMDRD1819

Summary

The position is responsible for developing packaging design in one of the following areas: 3D sensing light or VSCEL/ APD or coherent light or long distance (40km, 80km) over 100G light engine packaging. The candidate will be expected to be the technical lead for the packaging design, prototyping, and manufacture procedure. The ideal candidate will also develop chip-to-chip alignment packaging.

Job Duties

  • Lead the effort of developing packaging design in one of the following areas: 3D sensing light or VSCEL/ APD or coherent light or long distance (40km, 80km) over 100G light engine packaging.
  • Lead the effort to develop chip-to-chip alignment packagings.
  • Contribute to hands-on experimental work.
  • Direct daily activities of packaging engineers, technicians and operators.
  • Document and present technical data to RD team.

Education

PHD in Electrical Engineering/ Mechanical Engineering/ Physics

Experience   

1-3 years of experience in high speed LASER packaging is a plus

Others       

Solidworks / Zemax; Thermal simulation; Optical simulation    

LOCATION

Houston, TX 

RD Packaging Design Engineer

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