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R&D Packaging Design Engineer
Department: OMD R&D
Job Code: OMDRD1819
Summary
The position is responsible for developing packaging design in one of the following areas: 3D sensing light or VSCEL/ APD or coherent light or long distance (40km, 80km) over 100G light engine packaging. The candidate will be expected to be the technical lead for the packaging design, prototyping, and manufacture procedure. The ideal candidate will also develop chip-to-chip alignment packaging.
Job Duties
- Lead the effort of developing packaging design in one of the following areas: 3D sensing light or VSCEL/ APD or coherent light or long distance (40km, 80km) over 100G light engine packaging.
- Lead the effort to develop chip-to-chip alignment packagings.
- Contribute to hands-on experimental work.
- Direct daily activities of packaging engineers, technicians and operators.
- Document and present technical data to RD team.
Education
PHD in Electrical Engineering/ Mechanical Engineering/ Physics
Experience
1-3 years of experience in high speed LASER packaging is a plus
Others
Solidworks / Zemax; Thermal simulation; Optical simulation
LOCATION
Houston, TX