R&D High Speed Packaging Engineer
Department: OMD R&D
Job Code: OMDRD1816
Candidate to be in charge of develop high speed long-haul packaging products, including 100/ 200/ 400G/ DCI/ EML; Candidate need to build prototype; Setup production line and transfer to production line at both US and Asia. Light engine, BOSA, SFP packaging experience is a must. Experience in semiconductor, modulator, AWG, PLC process is a plus.
- Design and develop high speed optical products (100/ 200/ 400G/ DCI/ EML) from initial concept to production release.
- Work closely with other design groups, support the team by providing appropriate design reviews, committing to development schedules, and meeting project milestones.
- Build and transfer production line to US and Asia.
MS degree in Physics, E.E. Engineering or equivalent
2+ Years packaging experience in optoelectronics, AWG, PLC, Modulator
Solidworks / Zemax; Thermal simulation; Optical simulation